DKN Research Newsletter

#1115, June 26, 2011 (English Edition)

Electronic Packaging Industry News from Japan & Asia

(www.dknresearch.com)

JPCA SHOW 2011 (Part II)

I will not exaggerate if I say there were more than a thousand new products and technologies presented at the JPCA Show 2011.  Most of them were connected to the consumer electronics market in some way - materials, equipment, circuit boards, designs, IC packaging, application or assembling.   All of the electronics vendors that featured new products for the aforementioned segments concentrated on two consumer products - smart phones and Tablet PCs.   Products associated with flat screen 3D TVs were not as popular this year, but depending on marketing, it could be an extremely hot item next year.

Apple has expanded from computers to consumer electronics over the past couple of decades.  Sony’s Walk Man was the first portable music device; however, the iPod revolutionized the way we listen to music.   Large electronics companies rolled out similar MP3 products as the iPod gained popularity, but Apple still enjoys the highest market share.  The iPhone was the trail blazer that changed the image of cellular phones.  Its popularity continues to grow, and its profits contribute the largest percent of revenue for Apple.   The iPad was the first tablet PC and did indeed create a new market.  Sales continue to rise year over year, and competitive response was similar to the iPod.  Most of the large PC manufacturers launched their own version of the iPad, but again, Apple enjoys the lion’s share of the market.  The MacBook Air was inspired by the iPad.  It is the thinnest and lightest portable PC in the market, but it is not very popular within the business community.  It does have its niche with certain Apple customers – it is designed exclusively around flash storage.

There is no question that the Apple Company is on the cutting edge of consumer electronics.   Along with their innovative products came an inspiration for new designs and technologies.   The new Apple products continue to change technology for printed circuit boards and IC packaging.  Many companies featured products associated with smart phones and tablet PCs.  Multi-layer board manufacturers showcased thinner HDI boards with new embedded components for the next generation of portable electronics, and flex circuit manufacturers displayed high-density rigid/flex products for smart phones and tablet PCs.  Several industry experts were talking about new IC packaging technologies for mobile devices such as TSV (Through Silicon Via Holes) and TMV (Through Mold Via Holes) of PoP (Package on Package).   Substrate manufacturers had actual samples of build-up boards.  A new trend with substrates is the use of coreless boards to reduce their thickness.  Some manufacturers continue to have difficulties to obtain flatness with the substrates.      

One of my business acquaintances from the packaging industry shared with me a very frustrating situation with Apple.   Any extra business from the manufacture of Apple products hasn’t trickled down to Japanese manufacturers.  As a matter of fact, these manufacturers receive just a few crumbs from the plate.  Apple employs EMS companies outside of Japan to assemble their products, and use non – Japanese subcontractors to manufacture their A4 and A5 semiconductors.  All this business and hardly any of it benefits Japanese manufacturers.  So, these manufacturers now promote their high end products to domestic electronics companies. Unfortunately, these companies do not have Apple’s market share.    

      

Dominique K. Numakura

DKN Research, www.dknresearch.com

Headlines of the week

(Please contact haverhill@dknreseach.com for further information of the news.)

1.Tanaka Denshi Kogyo (Bonding wire supplier in Japan) 6/14

Has commercialized a new bonding wire made of silver metal.

2.Samsung Electronics (Major electronics company in Korea) 6/16

Has developed a new 3D memory device with a graphen material built on large size flexible substrates.

3.Mitsubishi Heavy Industry (Major machinery company in Japan) 6/16

Has developed the industry first large size movable lithium ion secondary battery with 1000kW capacity. The large system can be towed by tracks. 

4.Panasonic (Major electronics company in Japan) 6/20

Has developed the world first thermo/electric generator tube for geothermal power generation. A 10 cm long tube is capable to generate 1.3W.

5.Shinko Electric (Major substrate supplier in Japan) 6/20

Has started the volume production of “DDR3”, a new coreless substrate developed for thin semiconductor packages. It will provide more freedom for package designs.

6.AIST (R&D organization in Japan) 6/21

Has co-developed a new CIGS based flexible photovoltaic cell with Fuji Film. The new device had a 15.0% conversion rate.

7.Elpida Memory (Major semiconductor manufacturer in Japan) 6/27

Has started the sample supply of the new DDR3 SDRAM devices. The new device has 4 chips assembled by a TSV technology.

8.Panasonic Electric (Major circuit board material supplier in Japan) 6/22

Has proposed to introduce 3D mold circuit technology for medical use capsule cameras. The technology will be capable to reduce the size of the devices.

9.Mitsumi (Major device manufacturers in Japan) 6/24

Has unveiled a new sensor for digital blood pressure sensor. The new device is also capable to measure the softness of the blood vessels.