Product Lines of DKN Research

DKN Research offers a wide variety of hardware and software products.  Our selection is quite large – the following is just a few examples. DKN Research provides Taylor made products with appropriate engineering supports for your necessities.

                                                                                                    Click here for details. 

 

Material Available

    Plastic

        Polyimide, PET

        PEN, LCP, PEEK

    Metals

        Copper, Nickel

        Stainless Steel

        Various Alloys

    Ceramic

        Alumina

    Hybrid

        Metal/Plastic

Process

   Photolithography

   Etching

   Printing

   Plating

   Laser abrasion

   Sputtering

   Lamination

   Assembling

   Soldering

Circuit & Device

   Metal Copper Circuits

   Flexible Circuits

   Thick Film Circuits (Organic)

   Thick Film Circuits (Ceramic)

   Printed Components

   Sensors

  

  

Flexible EL * Ultra Thin and lightweight (Less than 100 micron is possible) * Simple Process (Can be produced by just Screen Printing) * Available in three colors (blue, pink, green) * Easy Pattern Formation (only changing screen) Click here to watch video.http://www.youtube.com/watch?v=PDbM5IJbsok

Flexible Circuit Substrates

* Ultra High Density Circuit (10 micron pitch, Multi-layer circuit possible)

* Double Side Circuits with Via Holes (40 micron pitch, 50 micron via hole possible)

* High Density Multi-Layer Circuit (60 micron pitch, 75 micron via hole possible)

* Flying Leads Structure

Functional Thick Film Printable & Flexible Circuits

* High Density Circuits (down to 70 micron pitch)

* Double Side Circuits with Via Holes (100 micron pitch, 80 micron via hole possible)

* Low Conductor Resistance Circuit (Soldering, Wire bonding, Flip chip bonding capable)

  1. *Embedded Devices (Resistors, Capacitors, Inductors, Antennas, Batteries, LED, LCD) can be directly printed.

UTF Connector (Ultra Thin Connector for Flexible Substrate) * Very Low Mounted Height (Less than 0.3mm from the PCB surface) * Removable * High Density Connection (Less than 100 micron pitch is possible) Variable fixing method – Mechanically, SMT Soldering, Adhesive Wide Range Varieties Flex to Rigid PCB, Flex to Flex, etc. The UTF connector is a custom designed product for customer specific applications Click here to see details and photos ../DKNRArchive/Connector/Entries/2011/5/27_konekutanobarieshon_Variations_of_UTF_Connector.html

Precious Components, Chemically Etched

* All kinds of metals and polyimide films

* Broad ranges of thicknesses

* 3D etching and hybrid etching

  1. *Combinations with laser and sputtering and chemical plating

  2. *Bonding & lamination of different materials

                                              

                                                                  

Advanced Screen-Printing, Equipments & Materials * Ultra Thin and lightweight (Less than 100 micron is possible) * Simple Process (Can be produced by just Screen Printing) * Available in three colors (blue, pink, green) * Easy Pattern Formation (only changing screen) Click here for detailed information.../DKNRArchive/Printable_Electronics/Printable_Electronics.html

Ultimate Technologies & Products


  1. *Ultra Thin Flex Circuits Down to 0.1 Micron Thick ☛

  2. *Copper-Free Flexible Substrates ☛

  3. *Metal-Free Circuits with Via Holes

  4. *Thin Microwave Absorption Film for GHz Band ☛

  5. *Very Thick Polyimide Sheets up to 225 Microns ☛

  6. *Very Long Flexible Substrates up to 1500 mm

  7. *Transparent Flexible Circuits